Printer with laser scanner and tool-mounted camera

ABSTRACT

A three-dimensional printer includes a laser line scanner and hardware to rotate the scanner relative to an object on a build platform. In this configuration, three-dimensional surface data can be obtained from the object, e.g., for use as an input to subsequent processing steps such as the generation of tool instructions to fabricate a three-dimensional copy of the object, or various surfaces thereof.

RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.13/623,996 filed Sep. 21, 2012, which claims the benefit of U.S. App.No. 61/677,749 filed on Jul. 31, 2012, each of which the entire contentis hereby incorporated by reference.

BACKGROUND

There remains a need for three-dimensional data acquisition to augmentthe use and operation of a three-dimensional fabrication system.

SUMMARY

A three-dimensional printer includes a laser line scanner and hardwareto rotate the scanner relative to an object on a build platform. In thisconfiguration, three-dimensional surface data can be obtained from theobject, e.g., for use as an input to subsequent processing steps such asthe generation of tool instructions to fabricate a three-dimensionalcopy of the object, or various surfaces thereof.

The laser line scanner may generally include a laser line projector anda camera or similar imaging device. In one aspect, a turntable or thelike may be integrated into the build platform to permit scanning aroundthe object with a fixed laser line scanner.

BRIEF DESCRIPTION OF THE FIGURES

The invention and the following detailed description of certainembodiments thereof may be understood by reference to the followingfigures:

FIG. 1 is a block diagram of a three-dimensional printer.

FIG. 2 shows a three-dimensional printer with a laser line scanner.

FIG. 3 shows a method for using laser line scan data inthree-dimensional fabrication environment.

FIG. 4 shows a method for using laser line scan data in athree-dimensional

DETAILED DESCRIPTION

All documents mentioned herein are hereby incorporated in their entiretyby reference. References to items in the singular should be understoodto include items in the plural, and vice versa, unless explicitly statedotherwise or clear from the text. Grammatical conjunctions are intendedto express any and all disjunctive and conjunctive combinations ofconjoined clauses, sentences, words, and the like, unless otherwisestated or clear from the context. Thus the term “or” should generally beunderstood to mean “and/or” and so forth.

The following description emphasizes three-dimensional printers usingfused deposition modeling or similar techniques where a bead of materialis extruded in a series of two dimensional paths to form athree-dimensional object from a digital model, it will be understoodthat numerous additive fabrication techniques are known in the artincluding without limitation multijet printing, stereolithography,Digital Light Processor (“DLP”) three-dimensional printing, selectivelaser sintering, and so forth. Any such techniques may benefit from thesystems and methods described below, and all such printing technologiesare intended to fall within the scope of this disclosure, and within thescope of terms such as “printer”, “three-dimensional printer”,“fabrication system”, and so forth, unless a more specific meaning isexplicitly provided or otherwise clear from the context.

FIG. 1 is a block diagram of a three-dimensional printer. In general,the printer 100 may include a build platform 102, an extruder 106, anx-y-z positioning assembly 108, and a controller 110 that cooperate tofabricate an object 112 within a working volume 114 of the printer 100.

The build platform 102 may include a surface 116 that is rigid andsubstantially planar. The surface 116 may provide a fixed, dimensionallyand positionally stable platform on which to build the object 112. Thebuild platform 102 may include a thermal element 130 that controls thetemperature of the build platform 102 through one or more active devices132, such as resistive elements that convert electrical current intoheat, Peltier effect devices that can create a heating or coolingaffect, or any other thermoelectric heating and/or cooling devices. Thethermal element 130 may be coupled in a communicating relationship withthe controller 110 in order for the controller 110 to controllablyimpart heat to or remove heat from the surface 116 of the build platform102.

The extruder 106 may include a chamber 122 in an interior thereof toreceive a build material. The build material may, for example, includeacrylonitrile butadiene styrene (“ABS”), high-density polyethylene(“HDPL”), polylactic acid (“PLA”), or any other suitable plastic,thermoplastic, or other material that can usefully be extruded to form athree-dimensional object. The extruder 106 may include an extrusion tip124 or other opening that includes an exit port with a circular, oval,slotted or other cross-sectional profile that extrudes build material ina desired cross-sectional shape.

The extruder 106 may include a heater 126 to melt thermoplastic or othermeltable build materials within the chamber 122 for extrusion through anextrusion tip 124 in liquid form. While illustrated in block form, itwill be understood that the heater 126 may include, e.g., coils ofresistive wire wrapped about the extruder 106, one or more heatingblocks with resistive elements to heat the extruder 106 with appliedcurrent, an inductive heater, or any other arrangement of heatingelements suitable for creating heat within the chamber 122 sufficient tomelt the build material for extrusion. The extruder 106 may also orinstead include a motor 128 or the like to push the build material intothe chamber 122 and/or through the extrusion tip 124.

In general operation (and by way of example rather than limitation), abuild material such as ABS plastic in filament form may be fed into thechamber 122 from a spool or the like by the motor 128, melted by theheater 126, and extruded from the extrusion tip 124. By controlling arate of the motor 128, the temperature of the heater 126, and/or otherprocess parameters, the build material may be extruded at a controlledvolumetric rate. It will be understood that a variety of techniques mayalso or instead be employed to deliver build material at a controlledvolumetric rate, which may depend upon the type of build material, thevolumetric rate desired, and any other factors. All such techniques thatmight be suitably adapted to delivery of build material for fabricationof a three-dimensional object are intended to fall within the scope ofthis disclosure.

The x-y-z positioning assembly 108 may generally be adapted tothree-dimensionally position the extruder 106 and the extrusion tip 124within the working volume 114. Thus by controlling the volumetric rateof delivery for the build material and the x, y, z position of theextrusion tip 124, the object 112 may be fabricated in three dimensionsby depositing successive layers of material in two-dimensional patternsderived, for example, from cross-sections of a computer model or othercomputerized representation of the object 112. A variety of arrangementsand techniques are known in the art to achieve controlled linearmovement along one or more axes. The x-y-z positioning assembly 108 may,for example, include a number of stepper motors 109 to independentlycontrol a position of the extruder 106 within the working volume alongeach of an x-axis, a y-axis, and a z-axis. More generally, the x-y-zpositioning assembly 108 may include without limitation variouscombinations of stepper motors, encoded DC motors, gears, belts,pulleys, worm gears, threads, and so forth. For example, in one aspectthe build platform 102 may be coupled to one or more threaded rods by athreaded nut so that the threaded rods can be rotated to provide z-axispositioning of the build platform 102 relative to the extruder 124. Thisarrangement may advantageously simplify design and improve accuracy bypermitting an x-y positioning mechanism for the extruder 124 to be fixedrelative to a build volume. Any such arrangement suitable forcontrollably positioning the extruder 106 within the working volume 114may be adapted to use with the printer 100 described herein.

In general, this may include moving the extruder 106, or moving thebuild platform 102, or some combination of these. Thus it will beappreciated that any reference to moving an extruder relative to a buildplatform, working volume, or object, is intended to include movement ofthe extruder or movement of the build platform, or both, unless a morespecific meaning is explicitly provided or otherwise clear from thecontext. Still more generally, while an x, y, z coordinate system servesas a convenient basis for positioning within three dimensions, any othercoordinate system or combination of coordinate systems may also orinstead be employed, such as a positional controller and assembly thatoperates according to cylindrical or spherical coordinates.

The controller 110 may be electrically or otherwise coupled in acommunicating relationship with the build platform 102, the x-y-zpositioning assembly 108, and the other various components of theprinter 100. In general, the controller 110 is operable to control thecomponents of the printer 100, such as the build platform 102, the x-y-zpositioning assembly 108, and any other components of the printer 100described herein to fabricate the object 112 from the build material.The controller 110 may include any combination of software and/orprocessing circuitry suitable for controlling the various components ofthe printer 100 described herein including without limitationmicroprocessors, microcontrollers, application-specific integratedcircuits, programmable gate arrays, and any other digital and/or analogcomponents, as well as combinations of the foregoing, along with inputsand outputs for transceiving control signals, drive signals, powersignals, sensor signals, and so forth. In one aspect, this may includecircuitry directly and physically associated with the printer 100 suchas an on-board processor. In another aspect, this may be a processorassociated with a personal computer or other computing device coupled tothe printer 100, e.g., through a wired or wireless connection.Similarly, various functions described herein may be allocated betweenan on-board processor for the printer 100 and a separate computer. Allsuch computing devices and environments are intended to fall within themeaning of the term “controller” or “processor” as used herein, unless adifferent meaning is explicitly provided or otherwise clear from thecontext.

A variety of additional sensors and other components may be usefullyincorporated into the printer 100 described above. These othercomponents are generically depicted as other hardware 134 in FIG. 1, forwhich the positioning and mechanical/electrical interconnections withother elements of the printer 100 will be readily understood andappreciated by one of ordinary skill in the art.

The other hardware 134 may include a temperature sensor positioned tosense a temperature of the surface of the build platform 102, the object112 (or a surface of the object 112), the working volume 114, theextruder 126, and/or any other system components. This may, for example,include a thermistor or the like embedded within or attached below thesurface of the build platform 102. This may also or instead include aninfrared detector or the like directed at the surface 116 of the buildplatform 102 or the object 112.

In another aspect, the other hardware 134 may include a sensor to detecta presence of the object 112 at a predetermined location. This mayinclude an optical detector arranged in a beam-breaking configuration tosense the presence of the object 112 at a predetermined location. Thismay also or instead include an imaging device and image processingcircuitry to capture an image of the working volume and to analyze theimage to evaluate a position of the object 112. This sensor may be usedfor example to ensure that the object 112 is removed from the buildplatform 102 prior to beginning a new build on the working surface 116.Thus the sensor may be used to determine whether an object is presentthat should not be, or to detect when an object is absent. The feedbackfrom this sensor may be used by the controller 110 to issue processinginterrupts or otherwise control operation of the printer 100.

The other hardware 134 may also or instead include a heating element(instead of or in addition to the thermal element 130) to heat theworking volume such as a radiant heater or forced hot air heater tomaintain the object 112 at a fixed, elevated temperature throughout abuild, or the other hardware 134 may include a cooling element to coolthe working volume.

The other hardware 134 may include a port for a removable andreplaceable memory such as an SD card so that printable objects and/ortool instructions can be provided to the printer 100 on a portablememory.

In general, the above system can build a three-dimensional object bydepositing lines of build material in successive layers—two-dimensionalpatterns derived from the cross-sections of the three-dimensionalobject. As described below, three-dimensional printing may be augmentedwith the acquisition of three-dimensional data, e.g., from a rotatingbuild platform and a laser line scanner.

FIG. 2 shows a three-dimensional printer with a laser line scanner. Ingeneral, the three-dimensional printer may be any fabrication system,such as any of the three-dimensional printers described above or anyother fabrication system using fused deposition modeling,stereolithography, Digital Light Processing (“DLP”) three-dimensionalprinting, selective laser sintering, or any other additive fabricationsystem/process. The device 200 may include a working volume 202, a laserline projector 204, a camera 206, a build platform 208, a build platformdrive 210, and a controller 212 such as any of the controllers describedabove to coordinate and control operation of components of the device200.

The working volume 202 may be a working or build volume of athree-dimensional printer such as the device 200 depicted in the figure.It will be appreciated that the principles of the invention may beequally applicable to a scanner that is independent of the device 200,in which case the working volume 202 may simply be a scanning volume fora three-dimensional scanner that uses laser light scanning to captureand process three-dimensional data as described below.

The laser line projector 204 may include a laser light source such as ared laser pointer of class 1 or 1M and any arrangement of components todistribute a line of laser light over an arc 214 to provide a plane oflaser illumination. This may include any suitable active or passiveoptical elements such as a lens that distributes light across the planein an arc, or moving mirror or other mechanism that oscillates to directthe light across the plane. Thus it will be understood that the term“line” as used herein may refer to an actual line, e.g., through anoptical spreader, or a laser dot that moves through a line or arc withsufficient speed to permit capture of a line with the camera 206. Itwill further be appreciated that a simple laser dot may also or insteadbe employed, although this may require additional image capture, objectmovement, and/or laser light source movement. All such variations areintended to fall within the scope of a laser line projector 204 ascontemplated herein. Similarly, a laser line may include a line or anynumber and arrangement of laser dots capable of achieving similaraffects. The laser line projector 204 may be directed toward the workingvolume 202 in order to illuminate an object within the working volume202. In one aspect, the laser line projector 204 may be on top of theworking volume 202 and project downward. The laser line projector 204may also or instead be affixed to, or otherwise mounted in a fixedrelationship to, a tool head or the like, providing x-y-z positioningcapabilities using the corresponding hardware of a fabrication system.

The camera 206 may include any imaging hardware and/or software forcapturing electronic images, including without limitation digitalcameras, digital video devices, and so forth. The camera 206 may bedirected toward the working volume 202 in order to capture images of anobject within the working volume. The camera 206 may be positioned at adifferent location than the laser line projector 204 about an axis 216of the working volume 202, such as the z-axis, in order to permitresolution of three-dimensional data from a laser line contour cast bythe laser line projector 204 onto the object. More generally, the camera206 may have any pose useful for capturing three-dimensional data from alaser line projected by the laser line projector 204. The camera 206may, for example, be positioned on top of the working volume 202 and/oraffixed to, or otherwise mounted in a fixed relationship to, a tool headsuch as the extruder 106 to permit positioning of the camera 206relative to the working volume 202 using the x-y-z positioning assembly108. The object is not shown in FIG. 2 for purposes of simplicity, butit will be understood that the object may be any object within theworking volume such as an object resting on the build platform 208.

The build platform 208 may be positioned within the working volume 202,and may include a planar surface 218 to support an object duringscanning or fabrication. In general, the build platform 208 may be anyof the build platforms described above.

The build platform 208 may be coupled to a rotational drive 210 torotate the build platform 208 about an axis 216 perpendicular to theplanar surface 218, such as the z-axis for the build platform 208 or anyaxis parallel to the z-axis, or more generally, any axis passing throughthe working volume 202. In this manner, an object may be rotated througha number of poses relative to the laser line source 204 and the camera206 in order to permit extraction of three-dimensional data from varioussurfaces of the object. While this arrangement provides convenientaccess to various poses of the object, it will be understood thatvarious other hardware arrangements may be deployed to similar affect.For example, the camera 206 and/or the laser line source 204 may revolvearound the working volume 202 to obtain multiple views of the object.Multiple cameras may also or instead be deployed to capture images fromvarious poses, and/or a number of mirrors may be employed to direct thelaser beam from the laser line source 204 through the working volume 202in various orientations. Thus while emphasis here is on a simplerotating build platform, this exemplary embodiment is not intended tolimit the scope of this disclosure. In this more general context, itwill be understood that rotating an object about an axis refers to therelative orientation of the object to the laser light source 204 and/orcamera 206, and does not require any specific motion of the buildplatform 208 or the object. For example, the object may be “rotated” onthe axis 216 while the object and the build platform 208 remainstationary by revolving or otherwise directing the imaging hardware tovarious poses around the object, in which case the axis 216 is definedwith respect to motion of the imaging hardware rather than motion of thebuild platform 208.

The rotational drive 210 may include any combination of motors, gears,and so forth suitable to rotate the build platform 208 about an axissuch as the axis 216 described above. The axis 216 may, for example,include the z-axis of a fabrication system, or any parallel axisthereto, or any other suitable axis upon which the object can be rotatedwithin the working volume 202.

The controller 212 may be any processor or combination of processors orother processing circuitry that can control operation of the rotationaldrive 210, the laser line projector 204, and the camera 206 to capturethree-dimensional data such as a point cloud from a surface of theobject within the working volume 202. To this end, the controller 212may provide control signals to, and/or receive data from othercomponents of the device 200 to obtain three-dimensional data for thesurface of the object. The controller 212 may be any of the controllersdescribed above. This may include a controller or processor installed inthe device 200, or a processor or the like separate from the device 200such as within an attached computer, or any combination of these.

In general, the controller 212 may operate the rotational drive 210 torotate the build platform 208 about an axis while operating the laserline source 204 to illuminate a surface of the object with a laser lineto provide a contour line of laser light on the surface. The controller212 may concurrently operate the camera 206 to capture images of thesurface illuminated with the laser line. The controller 212 may befurther configured with suitable programming to process the images toobtain three-dimensional data. The controller may for example beconfigured to extract a number of two dimensional outlines of the objectat a number of positions along the axis 216 from the three-dimensionaldata, thereby providing planar outline data such as cross sections ofthe object along the axis 216. As described below in greater detail, thecontroller 212 may be further configured to generate tool instructionssuch as a tool path for the device 200 based on the planar outline data,the tool instructions including instructions to the device 200 tofabricate a three-dimensional copy of the surface of the object. Bygoing directly from the acquired point cloud and/or planar outline datato tool instructions such as a tool path, the methods and systemsdescribed herein can advantageously omit the computationally expensivecreation of interim computer models such as a polygonal mesh. Theresulting digital representation may also be more amenable to directmanual or computer manipulation because the planar outline datacorresponds more intuitively to tool instructions found in, e.g., a toolpath for a three-dimensional printer.

FIG. 3 shows a method for using laser line scan data inthree-dimensional fabrication environment. By directly samplingthree-dimensional data for cross sections of an object at predeterminedz-axis positions, such as positions of layers of a three-dimensionalfabrication process, data for tool instructions can be directly acquiredwithout the need for intermediate processing such as creation of apolygonal mesh.

As shown in step 302, the process 300 may begin with positioning anobject within a scan volume such as an interior of a three-dimensionalscanner or a three-dimensional printer.

As shown in step 304, the process 300 may include illuminating a surfaceof the object with a laser line. This may for example, includeilluminating the object using any of the laser line sources describedabove.

As shown in step 306, the process 300 may include capturing a pluralityof images of the laser line on the surface while rotating the objectabout a first axis. The laser line may appear on the surface as a litcontour on the object in a plane of the laser line, and a camera maycapture a number of images of the object from various poses (of theobject relative to the laser line, and/or the camera). The first axismay conveniently be parallel to or the same as a z-axis of a fabricationsystem.

As shown in step 308, the process 300 may include analyzing theplurality of images to capture a three-dimensional measurement at eachone of a number of z-axis positions along a second axis. This type ofthree-dimensional processing is well understood in the art, so theintricacies of and variations to such techniques are not chronicled herein detail. Using relatively simple geometric calculations, along withknown positions of the camera relative to the laser line source, aposition of the lit contour in an image field of the camera may bereadily converted into three-dimensional data for the contour. Wherez-axis positions for measurements are predetermined, the contour may besampled for three-dimensional data at each z-axis position directly froma position of the contour within the image. In this manner, a number ofmeasurements can be provided for each one of the z-axis positions. Thesecond axis (for z-axis positions) may be the same as the first axis(for rotation of the object), such as where the scan volume is theworking volume of a three-dimensional printer that has a rotating buildplatform.

As shown in step 310, the process 300 may include combining theplurality of measurements for one of the z-axis positions to provide across section of the object perpendicular to the second axis at that oneof the z-axis positions. This cross section may include any number ofpoints according to the rate at which images are captured relative to aspeed of rotation of the object around the axis. In this manner, theprocess 300 may provide a digital representation of the object includinga plurality of cross sections at a plurality of z-axis positions. Thenumber of such points required for a sufficiently detailed cross sectionwill of course depend upon the nature of the fabrication process forwhich the image is being obtained, or more generally the intended use ofthe cross-sectional data.

As shown in step 312, the process 300 may include creating toolinstructions for a fabrication system to fabricate a copy of the objectusing at least a portion of the plurality of cross sections to reproducethe surface of the object. More generally, the cross sections may beused to characterize external dimensions of the object at acorresponding z-axis step of the fabrication process. This outline may,for example, directly define a tool path of a fused deposition modelingprocess or characterize an exterior limit of a slice of an object in astereolithography process. Infilling for this two-dimensional boundaryof the object may be completed using any suitable techniques to createan internal geometry for the fabricated copy of the object.

FIG. 4 shows a method for using laser line scan data in athree-dimensional fabrication environment. While the above process 300generally contemplates direct conversion of laser line contours to toolinstructions, it is also possible to capture a general point cloud fromlaser line scanning and then sample this point cloud at various z-axispositions to obtain cross sections that can be used as described above.While capturing a full point cloud for an object may require additionalprocessing, it still avoids the need to create a polygonal mesh or othermore complex interim representations, while providing greaterflexibility in how data from the scan is processed into cross-sectionalimages useful for tooling.

As shown in step 402, the process 400 may begin with positioning anobject within a scan volume. As shown in step 404, the process 400 mayinclude illuminating a surface of the object with a laser line.

As shown in step 406, the process 400 may include capturing a pluralityof images of the laser line on the surface while rotating the objectabout a first axis. Rotating the object around the first axis mayinclude rotating a platform on which the object rests, such as a buildplatform of an additive fabrication system. Rotating the object aroundthe first axis may also or instead include revolving a camera thatcaptures the plurality of images around the object, or revolving asource of the laser line around the object.

As shown in step 408, the process 400 may include analyzing theplurality of images to provide a point cloud including a plurality ofsurface outlines of the object in three dimensions. To obtain a pointcloud, each laser-illuminated contour may be processed as describedabove to obtain a number of points (in three-dimensions) along thecontour for each image captured. These data sets may be registered toone another (e.g., based on known positions of the object, camera,and/or laser line source) to obtain a point cloud (comprised of theplurality of surface outlines) that more fully characterizing theexterior of the object. The point cloud may be filtered or otherwiseprocessed to provide spatial smoothing, remove outliers, and so forth.

As shown in step 410, the process 400 may include converting theplurality of surface outlines in the point cloud into a plurality ofcross sections, each one of the plurality of cross sections lying in aplane perpendicular to a second axis and at a different point along thesecond axis. That is, the point cloud representation may be sliced atvarious z-axis positions along the second axis to obtain cross sections.A variety of techniques may be employed in this step to determine, e.g.,what points to include or exclude in the outline, such as where numerouspoints are in regions between different z-axis positions. The secondaxis may, for example, be the same as the first axis and/or the secondaxis may correspond to a z-axis of a fabrication process. Similarly, theplurality of cross sections may be spaced apart at a distancecorresponding to a processing height of the fabrication process in orderto facilitate tool instruction generation or other processing that isdependent upon the fabrication process for which the data is intended.

As shown in step 412, the process 400 may include creating toolinstructions to fabricate a copy of the object using at least a portionof the plurality of cross sections to reproduce a shape of the surface.The tool instructions may, for example, include tool instructions for athree-dimensional printer using at least one of fused depositionmodeling, stereolithography, DLP three-dimensional printing, andselective laser sintering.

The methods or processes described above, and steps thereof, may berealized in hardware, software, or any combination of these suitable fora particular application. The hardware may include a general-purposecomputer and/or dedicated computing device. The processes may berealized in one or more microprocessors, microcontrollers, embeddedmicrocontrollers, programmable digital signal processors, or otherprogrammable device, along with internal and/or external memory. Theprocesses may also, or instead, be embodied in an application specificintegrated circuit, a programmable gate array, programmable array logic,or any other device or combination of devices that may be configured toprocess electronic signals. It will further be appreciated that one ormore of the processes may be realized as computer executable codecreated using a structured programming language such as C, an objectoriented programming language such as C++, or any other high-level orlow-level programming language (including assembly languages, hardwaredescription languages, and database programming languages andtechnologies) that may be stored, compiled or interpreted to run on oneof the above devices, as well as heterogeneous combinations ofprocessors, processor architectures, or combinations of differenthardware and software.

Thus, in one aspect, each method described above and combinationsthereof may be embodied in computer executable code that, when executingon one or more computing devices, performs the steps thereof. In anotheraspect, the methods may be embodied in systems that perform the stepsthereof, and may be distributed across devices in a number of ways, orall of the functionality may be integrated into a dedicated, standalonedevice or other hardware. In another aspect, means for performing thesteps associated with the processes described above may include any ofthe hardware and/or software described above. All such permutations andcombinations are intended to fall within the scope of the presentdisclosure.

It should further be appreciated that the methods above are provided byway of example. Absent an explicit indication to the contrary, thedisclosed steps may be modified, supplemented, omitted, and/orre-ordered without departing from the scope of this disclosure.

The method steps of the invention(s) described herein are intended toinclude any suitable method of causing such method steps to beperformed, consistent with the patentability of the following claims,unless a different meaning is expressly provided or otherwise clear fromthe context. So for example performing the step of X includes anysuitable method for causing another party such as a remote user or aremote processing resource (e.g., a server or cloud computer) to performthe step of X. Similarly, performing steps X, Y and Z may include anymethod of directing or controlling any combination of such otherindividuals or resources to perform steps X, Y and Z to obtain thebenefit of such steps.

While particular embodiments of the present invention have been shownand described, it will be apparent to those skilled in the art thatvarious changes and modifications in form and details may be madetherein without departing from the spirit and scope of this disclosureand are intended to form a part of the invention as defined by thefollowing claims, which are to be interpreted in the broadest senseallowable by law.

What is claimed is:
 1. A method comprising: positioning an object within a working volume of a three-dimensional printer; illuminating a surface of the object with a laser line; capturing a plurality of images of the laser line on the surface with a camera, wherein the camera is affixed to a toolhead of the three-dimensional printer and three-dimensionally positionable within the working volume using an x-y-z positioning assembly of the three-dimensional printer, the x-y-z positioning assembly configured to position the toolhead and the camera affixed thereto within the working volume for capturing surface data of the object used for a subsequent fabrication with the toolhead along a toolpath; analyzing the plurality of images to provide a point cloud representing a three-dimensional surface of the object and including a plurality of cross sections of the object, each one of the plurality of cross sections lying in a plane perpendicular to a z-axis of the three-dimensional printer and each one of the plurality of cross sections intersecting the z-axis at a different point; and creating tool instructions for a fabrication system to fabricate a copy of at least a portion of the object using at least a portion of the plurality of cross sections to reproduce the surface of the object, the tool instructions created directly from the point cloud without use of interim computer models.
 2. The method of claim 1 wherein the plurality of cross sections are spaced apart at a distance corresponding to a processing height of a fabrication process used by the three-dimensional printer.
 3. The method of claim 1 wherein the toolhead is an extruder.
 4. The method of claim 1 wherein the three-dimensional printer uses at least one of fused deposition modeling, stereolithography, DLP three-dimensional printing, and selective laser sintering.
 5. The method of claim 1 further comprising rotating the object around a first axis.
 6. The method of claim 5 wherein rotating the object around the first axis includes rotating a platform on which the object rests.
 7. The method of claim 6 wherein the platform is a build platform of an additive fabrication system.
 8. The method of claim 5 wherein rotating the object around the first axis includes revolving a source of the laser line around the object.
 9. The method of claim 1 wherein illuminating the object includes directing light from a laser through a lens that distributes the light across a plane.
 10. The method of claim 1 wherein illuminating the object includes directing light from a laser toward a moving mirror that oscillates to direct the light across a plane.
 11. A device comprising: a three-dimensional printer having a working volume; a build platform within the working volume, the build platform including a planar surface positioned to receive an object; a laser line projector directed toward the working volume; a camera affixed to a toolhead of the three-dimensional printer and three-dimensionally positionable within the working volume using an x-y-z positioning assembly of the three-dimensional printer, the x-y-z positioning assembly configured to position the toolhead and the camera affixed thereto within the working volume for capturing surface data of the object used for a subsequent fabrication with the toolhead along a toolpath; and a controller configured to coordinate operation of the laser line projector and the camera to capture three-dimensional data from a surface of the object within the working volume using illumination of the object by the laser line projector, thereby providing three-dimensional surface data for the object, the controller is further configured to extract a number of two dimensional outlines of the object at a number of positions along the axis from the three-dimensional data, thereby providing planar outline data, and the controller is further configured to generate tool instructions directly based on the planar outline data without use of interim computer models to fabricate a three-dimensional copy of the surface of the object.
 12. The device of claim 11 wherein the tool instructions include a tool path for a fused deposition modeling process.
 13. The device of claim 11 wherein the three-dimensional printer fabricates objects using at least one of fused deposition modeling, stereolithography, DLP three-dimensional printing, and selective laser sintering.
 14. The device of claim 11 wherein the three-dimensional surface data includes a point cloud of the surface of the object.
 15. The device of claim 11 wherein the three-dimensional data includes a plurality of cross-sections of the surface of the object at a plurality of predetermined positions along an axis through the working volume. 